8420-21A1-RK-TP 3M Electronic Solutions Division
Виробник: 3M Electronic Solutions Division
IC & Component Sockets 20P PLCC SOCKET SMT W/LOCATION POSTS
IC & Component Sockets 20P PLCC SOCKET SMT W/LOCATION POSTS
на замовлення 2543 шт:
термін постачання 21-30 дні (днів)
Кількість | Ціна без ПДВ |
---|---|
3+ | 124.07 грн |
10+ | 98.75 грн |
100+ | 80.58 грн |
250+ | 72 грн |
500+ | 65.72 грн |
1000+ | 55.61 грн |
2500+ | 53.9 грн |
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Технічний опис 8420-21A1-RK-TP 3M Electronic Solutions Division
Description: CONN SOCKET PLCC 20POS TIN, Features: Closed Frame, Packaging: Tube, Mounting Type: Surface Mount, Type: PLCC, Operating Temperature: -40°C ~ 105°C, Number of Positions or Pins (Grid): 20 (4 x 5), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 160.0µin (4.06µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 160.0µin (4.06µm), Contact Material - Post: Copper Alloy.
Інші пропозиції 8420-21A1-RK-TP
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
---|---|---|---|---|---|
8420-21A1-RK-TP | Виробник : 3M |
Description: CONN SOCKET PLCC 20POS TIN Features: Closed Frame Packaging: Tube Mounting Type: Surface Mount Type: PLCC Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 20 (4 x 5) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 160.0µin (4.06µm) Contact Material - Mating: Copper Alloy Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 160.0µin (4.06µm) Contact Material - Post: Copper Alloy |
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