BGA0011 Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: BGA-25 TO DIP-25 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.300" (17.78mm x 33.02mm)
Material: FR4 Epoxy Glass
Number of Positions: 25
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: BGA
Description: BGA-25 TO DIP-25 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.300" (17.78mm x 33.02mm)
Material: FR4 Epoxy Glass
Number of Positions: 25
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: BGA
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Технічний опис BGA0011 Chip Quik Inc.
Description: BGA-25 TO DIP-25 SMT ADAPTER, Packaging: Bulk, Size / Dimension: 0.700" x 1.300" (17.78mm x 33.02mm), Material: FR4 Epoxy Glass, Number of Positions: 25, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: BGA.
Інші пропозиції BGA0011
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
---|---|---|---|---|---|
BGA0011 | Виробник : Chip Quik | Sockets & Adapters BGA-25 to DIP-25 SMT Adapter |
товар відсутній |