MC33FS5502Y3ESR2 NXP USA Inc.
Виробник: NXP USA Inc.
Description: HIGH VOLTAGE PMIC QFN56
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Power Supplies
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: HIGH VOLTAGE PMIC QFN56
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Power Supplies
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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Технічний опис MC33FS5502Y3ESR2 NXP USA Inc.
Description: HIGH VOLTAGE PMIC QFN56, Packaging: Tape & Reel (TR), Package / Case: 56-VFQFN Exposed Pad, Mounting Type: Surface Mount, Wettable Flank, Operating Temperature: -40°C ~ 125°C (TA), Voltage - Supply: 60V, Applications: Power Supplies, Current - Supply: 15mA, Supplier Device Package: 56-HVQFN (8x8), Grade: Automotive, Qualification: AEC-Q100.
Інші пропозиції MC33FS5502Y3ESR2
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
 |
MC33FS5502Y3ESR2 | Виробник : NXP Semiconductors |
 Power Management Specialised - PMIC High Voltage power management IC, QFN56 |
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