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S32K324EHT1MMMSR NXP USA Inc.


Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
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Технічний опис S32K324EHT1MMMSR NXP USA Inc.

Description: IC, Packaging: Tape & Reel (TR), Package / Case: 257-LFBGA, Mounting Type: Surface Mount, Speed: 160MHz, Program Memory Size: 4MB (4M x 8), RAM Size: 512K x 8, Operating Temperature: -40°C ~ 125°C (TA), Oscillator Type: External, Internal, Program Memory Type: FLASH, EEPROM Size: 128K x 8, Core Processor: ARM® Cortex®-M7, Data Converters: A/D 24x12b SAR, Core Size: 32-Bit Dual-Core, Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V, Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART, Peripherals: DMA, I2S, WDT, Supplier Device Package: 257-LFBGA (14x14), Number of I/O: 218, Grade: Automotive, Qualification: AEC-Q100.

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S32K324EHT1MMMSR S32K324EHT1MMMSR Виробник : NXP Semiconductors S32K3xx-3306047.pdf ARM Microcontrollers - MCU S32K324 Arm Cortex-M7, 160 MHz, 4 MB Flash, CAN FD, Ethernet, HSE B security, 257 MAPBGA - S32K MCUs for General Purpose
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