Результат пошуку "thermopad" : 81
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| Фото | Назва | Виробник | Інформація |
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SP_1.0 SZARA 1W/MK 50X200X2 |
 Category: Thermoconductive tapesDescription: Tape: heat transfer; W: 50mm; L: 200mm; Thk: 2000um; 1W/mK; silicone Type of tape: heat transfer Width: 50mm Length: 0.2m Thickness: 2mm Thermal conductivity: 1W/mK Tape material: silicone Tape application: facilitates heat transfer; improvement of contact surface Operating temperature: -40...200°C Shore hardness: 60±5 Dielectric strength: 6kV/mm |
на замовлення 8 шт: термін постачання 21-30 дні (днів) |
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SP_1.0 SZARA 1W/MK 50X200X3 |
Category: Thermoconductive tapes Description: Tape: heat transfer; W: 50mm; L: 200mm; Thk: 3000um; 1W/mK; silicone Type of tape: heat transfer Width: 50mm Length: 0.2m Thickness: 3mm Thermal conductivity: 1W/mK Tape material: silicone Tape application: facilitates heat transfer; improvement of contact surface Operating temperature: -40...200°C Shore hardness: 60±5 Dielectric strength: 6kV/mm |
на замовлення 16 шт: термін постачання 21-30 дні (днів) |
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16494 | Vicor Corporation |
Description: THERMOPAD MINI Packaging: Tray For Use With/Related Products: VICOR Mini-Sized Modules Accessory Type: Thermal Pads |
товар відсутній |
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3M 8810 | 3M |
Category: Thermoconductive tapes Description: Tape: heat transfer; W: 38.1mm; L: 33m; Thk: 0.25mm; 600mW/mK; white Type of tape: heat transfer Width: 38.1mm Length: 33m Thickness: 0.25mm Thermal conductivity: 0.6W/mK Colour: white Tape application: bonding; heatsink mounting Flammability rating: UL-746C Density: 1.07g/cm3 Tape features: does not contain halogens; high mechanical strength Dielectric strength: 26kV/mm |
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3M 8810 | 3M |
Category: Thermoconductive tapes Description: Tape: heat transfer; W: 25mm; L: 33m; Thk: 0.25mm; 600mW/mK; white Type of tape: heat transfer Width: 25mm Length: 33m Thickness: 0.25mm Thermal conductivity: 0.6W/mK Colour: white Tape application: bonding; heatsink mounting Flammability rating: UL-746C Density: 1.07g/cm3 Tape features: does not contain halogens; high mechanical strength Dielectric strength: 26kV/mm |
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| 3M 8926 | 3M |
Category: Thermoconductive tapes Description: Tape: heat transfer; L: 40m; Thk: 0.5mm; 1.5W/mK; UL94V-0; 15kV/mm Type of tape: heat transfer Length: 40m Thickness: 0.5mm Thermal conductivity: 1.5W/mK Tape application: bonding; heatsink mounting Flammability rating: UL94V-0 Density: 1.6g/cm3 Dielectric strength: 15kV/mm |
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EDMHS12M2T2020075KIT | Wandboard | Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 0.75 MM THICKNESS FOR NXP I.MX6 DUAL / QUAD / QUADPLUS LIDDED OR I.MX8M |
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EDMHS12M2T2020125KIT | TechNexion | Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.25 MM THICKNESS FOR NXP I.MX6 SOLO / DUALLITE |
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EDMHSCP12201001 | TechNexion | Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.0 MM THICKNESS FOR MAPBGA AND UNLIDDED NXP CPUS + MYLAR |
товар відсутній |
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| GPN50 100MM X 10M |
Category: Thermoconductive tapes Description: Tape: heat transfer; W: 100mm; L: 10m; Thk: 0.05mm; 1100W/mK; 20MPa Type of tape: heat transfer Width: 0.1m Length: 10m Thickness: 50µm Thermal conductivity: 1100W/mK Tape application: facilitates heat transfer Version: glueless Operating temperature: -40...400°C Tensile strength: 20MPa Material: graphite Appearance: tape |
товар відсутній |
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| GPN50 200MM X 300MM |
Category: Thermoconductive tapes Description: Tape: heat transfer; L: 200÷300mm; Thk: 0.05mm; 1100W/mK; glueless Type of tape: heat transfer Length: 200...300mm Thickness: 50µm Thermal conductivity: 1100W/mK Tape application: facilitates heat transfer Version: glueless Operating temperature: -40...400°C Tensile strength: 20MPa Material: graphite Appearance: sheet |
товар відсутній |
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| GPN50 50MM X 10M |
Category: Thermoconductive tapes Description: Tape: heat transfer; W: 50mm; L: 10m; Thk: 0.05mm; 1100W/mK; glueless Type of tape: heat transfer Width: 50mm Length: 10m Thickness: 50µm Thermal conductivity: 1100W/mK Tape application: facilitates heat transfer Version: glueless Operating temperature: -40...400°C Tensile strength: 20MPa Material: graphite Appearance: tape |
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| GPN70 100MM X 10M |
Category: Thermoconductive tapes Description: Tape: heat transfer; W: 100mm; L: 10m; Thk: 0.07mm; 900W/mK; glueless Type of tape: heat transfer Width: 0.1m Length: 10m Thickness: 70µm Thermal conductivity: 900W/mK Tape application: facilitates heat transfer Version: glueless Operating temperature: -40...400°C Tensile strength: 20MPa Material: graphite Appearance: tape |
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GPN70 200MM X 300MM |
Category: Thermoconductive tapes Description: Tape: heat transfer; L: 200÷300mm; Thk: 0.07mm; 900W/mK; glueless Type of tape: heat transfer Length: 200...300mm Thickness: 70µm Thermal conductivity: 900W/mK Tape application: facilitates heat transfer Version: glueless Operating temperature: -40...400°C Tensile strength: 20MPa Material: graphite Appearance: sheet |
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PICOHS06M2T2020075KIT | TechNexion | Heat Sinks PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 0.75 MM THICKNESS FOR NXP i.MX6 QUAD LIDDED OR i.MX8M |
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PICOHS06M2T2020125KIT | TechNexion | Heat Sinks PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 1.25 MM THICKNESS FOR NXP i.MX6 SOLO OR DUALLITE |
товар відсутній |
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PICOHS06M2T2020175KIT | TechNexion | Heat Sinks PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 1.75 MM THICKNESS FOR NXP i.MX8M MINI |
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PICOHS12M2T2020075KIT | TechNexion | Heat Sinks PICO LOW-PROFILE HEATSINK 12MM + THERMOPAD WITH 0.75 MM THICKNESS FOR NXP i.MX6 QUAD LIDDED OR i.MX8M |
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PICOHS12M2T2020125KIT | Wandboard | Heat Sinks PICO LOW-PROFILE HEATSINK 12MM + THERMOPAD WITH 1.25 MM THICKNESS FOR NXP i.MX6 SOLO OR DUALLITE |
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PICOHS12M2T2020150KIT | Wandboard | Heat Sinks PICO LOW-PROFILE HEATSINK 12MM + THERMOPAD WITH 1.50 MM THICKNESS FOR NXP i.MX6 UL/ULL OR i.MX6 QUAD UNLIDDED or i.MX7 |
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PICOHS12M2T2020175KIT | TechNexion | Heat Sinks PICO LOW-PROFILE HEATSINK 12MM + THERMOPAD WITH 1.75 MM THICKNESS FOR NXP i.MX8M MINI |
товар відсутній |
| SP_1.0 SZARA 1W/MK 50X200X2 |
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Category: Thermoconductive tapes
Description: Tape: heat transfer; W: 50mm; L: 200mm; Thk: 2000um; 1W/mK; silicone
Type of tape: heat transfer
Width: 50mm
Length: 0.2m
Thickness: 2mm
Thermal conductivity: 1W/mK
Tape material: silicone
Tape application: facilitates heat transfer; improvement of contact surface
Operating temperature: -40...200°C
Shore hardness: 60±5
Dielectric strength: 6kV/mm
Description: Tape: heat transfer; W: 50mm; L: 200mm; Thk: 2000um; 1W/mK; silicone
Type of tape: heat transfer
Width: 50mm
Length: 0.2m
Thickness: 2mm
Thermal conductivity: 1W/mK
Tape material: silicone
Tape application: facilitates heat transfer; improvement of contact surface
Operating temperature: -40...200°C
Shore hardness: 60±5
Dielectric strength: 6kV/mm
на замовлення 8 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 525.17 грн |
| 3+ | 380.83 грн |
| 6+ | 360.02 грн |
| SP_1.0 SZARA 1W/MK 50X200X3 |
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Category: Thermoconductive tapes
Description: Tape: heat transfer; W: 50mm; L: 200mm; Thk: 3000um; 1W/mK; silicone
Type of tape: heat transfer
Width: 50mm
Length: 0.2m
Thickness: 3mm
Thermal conductivity: 1W/mK
Tape material: silicone
Tape application: facilitates heat transfer; improvement of contact surface
Operating temperature: -40...200°C
Shore hardness: 60±5
Dielectric strength: 6kV/mm
Description: Tape: heat transfer; W: 50mm; L: 200mm; Thk: 3000um; 1W/mK; silicone
Type of tape: heat transfer
Width: 50mm
Length: 0.2m
Thickness: 3mm
Thermal conductivity: 1W/mK
Tape material: silicone
Tape application: facilitates heat transfer; improvement of contact surface
Operating temperature: -40...200°C
Shore hardness: 60±5
Dielectric strength: 6kV/mm
на замовлення 16 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 667.11 грн |
| 2+ | 484.19 грн |
| 5+ | 457.83 грн |
| 16494 |
Виробник: Vicor Corporation
Description: THERMOPAD MINI
Packaging: Tray
For Use With/Related Products: VICOR Mini-Sized Modules
Accessory Type: Thermal Pads
Description: THERMOPAD MINI
Packaging: Tray
For Use With/Related Products: VICOR Mini-Sized Modules
Accessory Type: Thermal Pads
товар відсутній
| 3M 8810 |
Виробник: 3M
Category: Thermoconductive tapes
Description: Tape: heat transfer; W: 38.1mm; L: 33m; Thk: 0.25mm; 600mW/mK; white
Type of tape: heat transfer
Width: 38.1mm
Length: 33m
Thickness: 0.25mm
Thermal conductivity: 0.6W/mK
Colour: white
Tape application: bonding; heatsink mounting
Flammability rating: UL-746C
Density: 1.07g/cm3
Tape features: does not contain halogens; high mechanical strength
Dielectric strength: 26kV/mm
Category: Thermoconductive tapes
Description: Tape: heat transfer; W: 38.1mm; L: 33m; Thk: 0.25mm; 600mW/mK; white
Type of tape: heat transfer
Width: 38.1mm
Length: 33m
Thickness: 0.25mm
Thermal conductivity: 0.6W/mK
Colour: white
Tape application: bonding; heatsink mounting
Flammability rating: UL-746C
Density: 1.07g/cm3
Tape features: does not contain halogens; high mechanical strength
Dielectric strength: 26kV/mm
товар відсутній
| 3M 8810 |
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Виробник: 3M
Category: Thermoconductive tapes
Description: Tape: heat transfer; W: 25mm; L: 33m; Thk: 0.25mm; 600mW/mK; white
Type of tape: heat transfer
Width: 25mm
Length: 33m
Thickness: 0.25mm
Thermal conductivity: 0.6W/mK
Colour: white
Tape application: bonding; heatsink mounting
Flammability rating: UL-746C
Density: 1.07g/cm3
Tape features: does not contain halogens; high mechanical strength
Dielectric strength: 26kV/mm
Category: Thermoconductive tapes
Description: Tape: heat transfer; W: 25mm; L: 33m; Thk: 0.25mm; 600mW/mK; white
Type of tape: heat transfer
Width: 25mm
Length: 33m
Thickness: 0.25mm
Thermal conductivity: 0.6W/mK
Colour: white
Tape application: bonding; heatsink mounting
Flammability rating: UL-746C
Density: 1.07g/cm3
Tape features: does not contain halogens; high mechanical strength
Dielectric strength: 26kV/mm
товар відсутній
| 3M 8926 |
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Виробник: 3M
Category: Thermoconductive tapes
Description: Tape: heat transfer; L: 40m; Thk: 0.5mm; 1.5W/mK; UL94V-0; 15kV/mm
Type of tape: heat transfer
Length: 40m
Thickness: 0.5mm
Thermal conductivity: 1.5W/mK
Tape application: bonding; heatsink mounting
Flammability rating: UL94V-0
Density: 1.6g/cm3
Dielectric strength: 15kV/mm
Category: Thermoconductive tapes
Description: Tape: heat transfer; L: 40m; Thk: 0.5mm; 1.5W/mK; UL94V-0; 15kV/mm
Type of tape: heat transfer
Length: 40m
Thickness: 0.5mm
Thermal conductivity: 1.5W/mK
Tape application: bonding; heatsink mounting
Flammability rating: UL94V-0
Density: 1.6g/cm3
Dielectric strength: 15kV/mm
товар відсутній
| EDMHS12M2T2020075KIT |
Виробник: Wandboard
Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 0.75 MM THICKNESS FOR NXP I.MX6 DUAL / QUAD / QUADPLUS LIDDED OR I.MX8M
Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 0.75 MM THICKNESS FOR NXP I.MX6 DUAL / QUAD / QUADPLUS LIDDED OR I.MX8M
товар відсутній
| EDMHS12M2T2020125KIT |
Виробник: TechNexion
Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.25 MM THICKNESS FOR NXP I.MX6 SOLO / DUALLITE
Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.25 MM THICKNESS FOR NXP I.MX6 SOLO / DUALLITE
товар відсутній
| EDMHSCP12201001 |
Виробник: TechNexion
Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.0 MM THICKNESS FOR MAPBGA AND UNLIDDED NXP CPUS + MYLAR
Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.0 MM THICKNESS FOR MAPBGA AND UNLIDDED NXP CPUS + MYLAR
товар відсутній
| GPN50 100MM X 10M |
Category: Thermoconductive tapes
Description: Tape: heat transfer; W: 100mm; L: 10m; Thk: 0.05mm; 1100W/mK; 20MPa
Type of tape: heat transfer
Width: 0.1m
Length: 10m
Thickness: 50µm
Thermal conductivity: 1100W/mK
Tape application: facilitates heat transfer
Version: glueless
Operating temperature: -40...400°C
Tensile strength: 20MPa
Material: graphite
Appearance: tape
Description: Tape: heat transfer; W: 100mm; L: 10m; Thk: 0.05mm; 1100W/mK; 20MPa
Type of tape: heat transfer
Width: 0.1m
Length: 10m
Thickness: 50µm
Thermal conductivity: 1100W/mK
Tape application: facilitates heat transfer
Version: glueless
Operating temperature: -40...400°C
Tensile strength: 20MPa
Material: graphite
Appearance: tape
товар відсутній
| GPN50 200MM X 300MM |
Category: Thermoconductive tapes
Description: Tape: heat transfer; L: 200÷300mm; Thk: 0.05mm; 1100W/mK; glueless
Type of tape: heat transfer
Length: 200...300mm
Thickness: 50µm
Thermal conductivity: 1100W/mK
Tape application: facilitates heat transfer
Version: glueless
Operating temperature: -40...400°C
Tensile strength: 20MPa
Material: graphite
Appearance: sheet
Description: Tape: heat transfer; L: 200÷300mm; Thk: 0.05mm; 1100W/mK; glueless
Type of tape: heat transfer
Length: 200...300mm
Thickness: 50µm
Thermal conductivity: 1100W/mK
Tape application: facilitates heat transfer
Version: glueless
Operating temperature: -40...400°C
Tensile strength: 20MPa
Material: graphite
Appearance: sheet
товар відсутній
| GPN50 50MM X 10M |
Category: Thermoconductive tapes
Description: Tape: heat transfer; W: 50mm; L: 10m; Thk: 0.05mm; 1100W/mK; glueless
Type of tape: heat transfer
Width: 50mm
Length: 10m
Thickness: 50µm
Thermal conductivity: 1100W/mK
Tape application: facilitates heat transfer
Version: glueless
Operating temperature: -40...400°C
Tensile strength: 20MPa
Material: graphite
Appearance: tape
Description: Tape: heat transfer; W: 50mm; L: 10m; Thk: 0.05mm; 1100W/mK; glueless
Type of tape: heat transfer
Width: 50mm
Length: 10m
Thickness: 50µm
Thermal conductivity: 1100W/mK
Tape application: facilitates heat transfer
Version: glueless
Operating temperature: -40...400°C
Tensile strength: 20MPa
Material: graphite
Appearance: tape
товар відсутній
| GPN70 100MM X 10M |
Category: Thermoconductive tapes
Description: Tape: heat transfer; W: 100mm; L: 10m; Thk: 0.07mm; 900W/mK; glueless
Type of tape: heat transfer
Width: 0.1m
Length: 10m
Thickness: 70µm
Thermal conductivity: 900W/mK
Tape application: facilitates heat transfer
Version: glueless
Operating temperature: -40...400°C
Tensile strength: 20MPa
Material: graphite
Appearance: tape
Description: Tape: heat transfer; W: 100mm; L: 10m; Thk: 0.07mm; 900W/mK; glueless
Type of tape: heat transfer
Width: 0.1m
Length: 10m
Thickness: 70µm
Thermal conductivity: 900W/mK
Tape application: facilitates heat transfer
Version: glueless
Operating temperature: -40...400°C
Tensile strength: 20MPa
Material: graphite
Appearance: tape
товар відсутній
| GPN70 200MM X 300MM |
Category: Thermoconductive tapes
Description: Tape: heat transfer; L: 200÷300mm; Thk: 0.07mm; 900W/mK; glueless
Type of tape: heat transfer
Length: 200...300mm
Thickness: 70µm
Thermal conductivity: 900W/mK
Tape application: facilitates heat transfer
Version: glueless
Operating temperature: -40...400°C
Tensile strength: 20MPa
Material: graphite
Appearance: sheet
Description: Tape: heat transfer; L: 200÷300mm; Thk: 0.07mm; 900W/mK; glueless
Type of tape: heat transfer
Length: 200...300mm
Thickness: 70µm
Thermal conductivity: 900W/mK
Tape application: facilitates heat transfer
Version: glueless
Operating temperature: -40...400°C
Tensile strength: 20MPa
Material: graphite
Appearance: sheet
товар відсутній
| PICOHS06M2T2020075KIT |
Виробник: TechNexion
Heat Sinks PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 0.75 MM THICKNESS FOR NXP i.MX6 QUAD LIDDED OR i.MX8M
Heat Sinks PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 0.75 MM THICKNESS FOR NXP i.MX6 QUAD LIDDED OR i.MX8M
товар відсутній
| PICOHS06M2T2020125KIT |
Виробник: TechNexion
Heat Sinks PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 1.25 MM THICKNESS FOR NXP i.MX6 SOLO OR DUALLITE
Heat Sinks PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 1.25 MM THICKNESS FOR NXP i.MX6 SOLO OR DUALLITE
товар відсутній
| PICOHS06M2T2020175KIT |
Виробник: TechNexion
Heat Sinks PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 1.75 MM THICKNESS FOR NXP i.MX8M MINI
Heat Sinks PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 1.75 MM THICKNESS FOR NXP i.MX8M MINI
товар відсутній
| PICOHS12M2T2020075KIT |
Виробник: TechNexion
Heat Sinks PICO LOW-PROFILE HEATSINK 12MM + THERMOPAD WITH 0.75 MM THICKNESS FOR NXP i.MX6 QUAD LIDDED OR i.MX8M
Heat Sinks PICO LOW-PROFILE HEATSINK 12MM + THERMOPAD WITH 0.75 MM THICKNESS FOR NXP i.MX6 QUAD LIDDED OR i.MX8M
товар відсутній
| PICOHS12M2T2020125KIT |
Виробник: Wandboard
Heat Sinks PICO LOW-PROFILE HEATSINK 12MM + THERMOPAD WITH 1.25 MM THICKNESS FOR NXP i.MX6 SOLO OR DUALLITE
Heat Sinks PICO LOW-PROFILE HEATSINK 12MM + THERMOPAD WITH 1.25 MM THICKNESS FOR NXP i.MX6 SOLO OR DUALLITE
товар відсутній
| PICOHS12M2T2020150KIT |
Виробник: Wandboard
Heat Sinks PICO LOW-PROFILE HEATSINK 12MM + THERMOPAD WITH 1.50 MM THICKNESS FOR NXP i.MX6 UL/ULL OR i.MX6 QUAD UNLIDDED or i.MX7
Heat Sinks PICO LOW-PROFILE HEATSINK 12MM + THERMOPAD WITH 1.50 MM THICKNESS FOR NXP i.MX6 UL/ULL OR i.MX6 QUAD UNLIDDED or i.MX7
товар відсутній
| PICOHS12M2T2020175KIT |
Виробник: TechNexion
Heat Sinks PICO LOW-PROFILE HEATSINK 12MM + THERMOPAD WITH 1.75 MM THICKNESS FOR NXP i.MX8M MINI
Heat Sinks PICO LOW-PROFILE HEATSINK 12MM + THERMOPAD WITH 1.75 MM THICKNESS FOR NXP i.MX8M MINI
товар відсутній
Обрати Сторінку:
[ << Попередня Сторінка ]
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